Full Testing Capabilities
Comprehensive testing and inspection
capabilities for enhanced product quality
ENHANCING PLACEMENT ACCURACY AND RELIABILITY
Next Level Quality Assurance for Cost-Effective Manufacturing
The electronics industry faces intense competition due to product complexity and cost pressures on OEMs. OEMs require manufacturing partners capable of meeting their needs with quality, timely, and cost-effective solutions. While most Electronics Manufacturing Services (EMS) companies offer similar services, differences become apparent in facility setup, equipment, processes, and personnel.
Testing and inspection capabilities is crucial for maintaining product standards and reliability. PARPRO stands out with its comprehensive testing services covering all aspects of product reliability and functionality. From component scrutiny to system integration, PARPRO ensures top-tier quality and performance, instilling confidence and satisfaction in clients and end-users alike.
ADVANCED TESTING & INSPECTION
Delivering Repeatable Products with Greater Overall Fault Coverage
PCBA (Printed Circuit Board Assembly) testing and inspection capabilities are paramount in ensuring the quality, reliability, and performance of electronic devices. Through rigorous testing and inspection processes, PARPRO can identify potential defects, faults, and errors in the assembly process and rectify early on, preventing costly rework, repairs, or product recalls down the line. These capabilities help guarantee that electronic devices meet industry standards, regulatory requirements, and customer expectations for functionality and durability.
In essence, PARPRO’s PCBA testing, and inspection capabilities serve as a crucial quality assurance measure, safeguarding the integrity and reliability of electronic products throughout their lifecycle.
Our Test & Inspection Capabilities
- Flying Probe Test System - Takaya APT-1400F
- ICT (In-Circuit Testing) – Genrad
- J-Tag (Boundary Scan)
- Functional – Multiple Options and Recommendations
- System Level – Tuning Calibration
- 3D AOI
- 3D Inline SPI - Solder Paste Inspection (SPI) Systems
- 3D X-Ray – Inspection of BGA and Micro BGA components
- ESS Ovens for Thermal Testing
